Qnity

Qnity has introduced the Stackplane product family of CMP slurries for advanced packaging applications, including hybrid bonding and through-silicon vias (TSV). The platform includes five series (SP1000–SP5000) for wafer, die and glass planarization as well as panel-level applications, and complements the portfolio with CMP pads and post-CMP cleaning solutions. Qnity is presenting the products at SEMICON Taiwan and at the International Conference on Planarization/CMP Technology in Seoul. » More on de.investing.com

At the Deutsche Bank Technology Conference, Qnity said that the expansion of AI infrastructure is significantly accelerating demand for semiconductor materials and that advanced packaging and thermal management are becoming the main growth drivers. The interconnect solutions division recently grew organically by 28%; three top areas recorded over 50% growth in the first half. The company aims to generate about USD 100 million of additional EBITDA through a transformation program, raise the gross margin from the high-40s into the low-50s, and is using its independence from DuPont to speed up capacity expansions and acquisitions. » More on de.investing.com

Qnity has unveiled a materials solution platform that integrates metallization, bumping, dielectric materials and fine‑line conductor structuring for 2.5D, 3D and panel‑level packaging. The platform supports tin‑silver micro‑bumps, direct and hybrid copper‑to‑copper bonding, and high‑resolution processes with trace widths and spacings down to 2 µm. Highlighted products include the copper solutions Intervia CB1000+/CB3000, the Solderon TS8000 series and photosensitive Cyclotene for fan‑out panel‑level packaging. » More on de.investing.com