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BE Semiconductor after 40% decline: Berenberg sees buying opportunity
BE Semiconductor has experienced a marked correction after a drop of just over 40% from its high. Analysts at Berenberg rate the stock as a buy and see an entry opportunity for a counter-move. Besi supplies high-precision assembly and advanced-packaging systems, which are regarded as a central growth driver in the AI chip market. » Más en finanzen.net
BE Semiconductor falls after delay in hybrid-bonding technology
BE Semiconductor's shares fell further, dropping about 3.8% to €248.4 after reports suggested Samsung and SK Hynix could delay the use of hybrid-bonding technology for HBM. The reason appears to be new heat-dissipation solutions that reduce the urgent need to switch from thermocompression bonding and may make hybrid-bonding relevant only for later HBM generations. The potential delay hits BESI particularly hard, as hybrid-bonding is seen as a key growth driver and a major Samsung decision had been expected by mid-2026. Investors face increased uncertainty until the next report on July 23, while the sector as a whole is reacting to a slower pace of advanced-packaging investment. » Más en de.investing.com
BE Semiconductor falls sharply after reports of delay in hybrid bonding
BE Semiconductor’s shares fell about 7.5% to €252.60 after reports that Samsung and SK Hynix could delay the rollout of the hybrid-bonding process. The reason cited is a new heat-dissipation technology that could reduce the need for advanced packaging processes for HBM memory. The potential delay hits BE Semiconductor’s core revenue driver and compounds already negative analyst sentiment; Zacks recently cut its rating to "Hold." The next quarterly report on 23 July 2026 is likely to offer only limited visibility, while the stock is trading roughly 23% below its mid-June 52-week high. » Más en de.investing.com
BE Semiconductor raises revenue and margin targets and shares climb
BE Semiconductor shares rose 1.1% to €313.50 after the company at its Investor Day raised its revenue forecast to €1.7–2.2 billion (previously €1.5–1.9 billion) and increased the lower end of the operating margin from 40% to 45% (upper end 55%). Management cited robust demand from AI data centers and optical photonics and accelerated adoption of hybrid bonding as reasons, but did not provide a timeframe for the targets. Analyst reactions were positive: JPMorgan raised its price target and Goldman Sachs reiterated its buy recommendation, which, together with a constructive industry backdrop, supported the price movement. » Más en de.investing.com
BE Semiconductor rises after results, Deutsche Bank raises price target to €215
Shares of BE Semiconductor climbed about 5 percent and approached their record high after positive reactions to the company’s results. Deutsche Bank raised its price target to €215, citing sustained strong demand and possible integration of Dutch technology into Samsung’s HBM4E chips, a decision likely by June. At the same time, Bank of America rates Europe’s chip sector as underweight after the strong rally and recommends defensive sectors. » Más en finanzen.net
Dividendos históricos Dividendos
Todas las métricas de dividendos Todas las métricasDatos financieros de la empresa
| (EUR) | septiembre de 2026 | YoY |
|---|---|---|
| Ingresos | 283,4 M | 113,51 % |
| Beneficio bruto | 178,67 M | 131,98 % |
| Beneficio neto | 107,19 M | 324,02 % |
| EBITDA | 139,88 M | 216,87 % |
Datos fundamentales
| Métrica | Valor |
|---|---|
Capitalización bursátil | 11,34 mil M € |
Número de acciones | 79,08 M |
Máximo/mínimo de 52 semanas | 328,40 € - 120,15 € |
Rentabilidad por dividendo | 1,06 % |
Dividendos TTM | 1,58 € |
Beta | 1,36 |
Ratio P/E | 39,50 |
Ratio PEG | 0,42 |
Ratio P/B | 17,50 |
Ratio P/S | 12,82 |
Perfil de la empresa
BE Semiconductor Industries N.V. desarrolla, fabrica, comercializa, vende y presta servicios de equipos de ensamblaje de semiconductores para las industrias de semiconductores y de electrónica en todo el mundo. Los principales productos de la compañía incluyen equipos de unión de matrices (die attach), como sistemas de chip único, multichip, multimódulo, flip chip, unión por compresión térmica, empaquetado a nivel de oblea con fan out, unión de matrices híbrida e incrustada (embedded bridge) y sistemas de clasificación de matrices; y equipos de empaquetado, que incluyen moldeado convencional, ultrafino y a nivel de oblea, así como sistemas de recorte y conformado y de singulación. Sus productos principales también abarcan equipos de galvanoplastia, que comprenden estaño, cobre y metales preciosos, y sistemas de galvanoplastia para células solares, así como productos químicos de proceso relacionados; y utillaje, kits de conversión, piezas de repuesto y otros servicios. Las principales marcas de la compañía incluyen Datacon, Esec, Fico y Meco. Ofrece sus productos principalmente a fabricantes multinacionales de chips, subcontratistas de ensamblaje y empresas de electrónica e industriales. La compañía fue constituida en 1995 y tiene su sede en Duiven, Países Bajos.
| Nombre | BE Semiconductor Ind. |
| CEO | Richard W. Blickman |
| Sede | Duiven,
ge Países Bajos |
| Sitio web | |
| Sector | Tecnología de la información |
| Industria | Semiconductores y equipos de semiconductores |
| Salida a bolsa | 20/07/1998 |
| Empleados | 2001 |
Símbolos bursátiles
| Bolsa | Símbolo |
|---|---|
Euronext | BESI.AS |
Pnk | BESVF |
Amsterdam | BESI.AS |
XETRA | BSI.DE |
Düsseldorf | BSI.DU |
London | 0XVE.L |
München | BSI.MU |