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SK Hynix to build $4 billion memory packaging plant in Indiana, aims to make state HBM base by 2030
SK Hynix held a groundbreaking for a $4 billion advanced memory packaging facility in West Lafayette, Indiana, saying the site will become a key high-bandwidth memory (HBM) production base in the U.S. by 2030. The plant will perform packaging and stacking of chips made in South Korea and China, with the first cleanroom scheduled to open in October 2028. SK Hynix expects U.S. investments and assets to exceed $45 billion by 2030, will receive up to $458 million in CHIPS Act support and up to $712 million in state incentives, and projects about 1,000 direct jobs plus 6,000 related roles. » Plus sur cnbc.com
SK Hynix share falls after union rejects pay deal
The SK Hynix share dropped 3.6% to 1,611,000 ₩ after a major union rejected a provisional pay package. Just over 50% of the 15,045 union members voted against the agreement, which would have included a 6.3% wage increase and a shift in profit-sharing to 40% cash and 60% stock. The reaction comes against the backdrop of strong profits from AI demand, disappointing profit-distribution measures at Samsung and jitters in the semiconductor sector ahead of Nvidia’s quarterly results; the KOSPI fell around 3%. » Plus sur de.investing.com
SK hynix launches historic share buyback program worth 40 trillion won
SK hynix announces a share buyback and cancellation program totaling 40 trillion won (about $29 billion), starting today and running for roughly three months until mid-November. Up to around 24 million shares will be permanently cancelled, equivalent to about 3.3% of outstanding shares, which will boost earnings per share. The company raised its shareholder return target to over 50% of cumulative free cash flow for 2025–2027; JPMorgan estimates additional payouts through 2027 of at least $130 billion. The announcement pushed the stock sharply higher and supported the valuation given a net cash position of about 69 trillion won at the end of Q2 2026. » Plus sur de.investing.com
Dividendes historiques Dividendes
Tous les indicateurs de dividendes Tous les indicateursDonnées financières de l'entreprise
| (EUR) | juin 2026 | |
|---|---|---|
| Chiffre d'affaires | 44,85Md | 221,18% |
| Bénéfice brut | 37,21Md | 394,37% |
| Bénéfice net | 53,11Md | 1.108,34% |
| EBITDA | 36,51Md | 368,88% |
Données fondamentales
| Indicateur | Valeur |
|---|---|
Capitalisation boursière | 739,89Md€ |
Nombre d'actions | 709,85M |
Plus haut/bas sur 52 semaines | 1.855,40€ - 157,15€ |
Dividendes TTM | 1,74€ |
Bêta | 2,41 |
Ratio P/E | 7,33 |
Ratio PEG | 0,02 |
Ratio P/B | 4,56 |
Ratio P/S | 6,30 |
Profil de l'entreprise
SK hynix Inc. ist zusammen mit seinen Tochtergesellschaften in der Herstellung, dem Vertrieb und dem Verkauf von Halbleiterprodukten weltweit tätig. Das Unternehmen bietet Speicher-Halbleiterprodukte wie DRAM, NAND-Flash, Multi-Chip-Pakete usw. sowie System-Halbleiter wie CMOS-Bildsensoren usw. an. Die Produkte des Unternehmens werden in Servern, Netzwerken, Mobiltelefonen, Personalcomputern, Unterhaltungselektronik und in der Automobilindustrie eingesetzt. Das Unternehmen war früher als Hynix Semiconductor Inc. bekannt und änderte im März 2012 seinen Namen in SK hynix, Inc. SK hynix, Inc. wurde 1949 gegründet und hat seinen Hauptsitz in Icheon-si, Südkorea.
| Nom | SK Hynix |
| PDG | Noh-Jung Kwak |
| Siège social | Icheon-Si,
gy Corée du Sud |
| Site web | |
| Secteur | Technologies de l'information |
| Industrie | Semi-conducteurs et équipements pour semi-conducteurs |
| Introduction en bourse | 04/01/2000 |
| Employés | 34.549 |
Deep Dive
Symboles boursiers
| Bourse | Symbole |
|---|---|
Korea Exchange | 000660.KS |
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