TSMC

Huawei introduces the Kirin 9050 Pro, which uses the Logic Folding technique to join two wafers via Hybrid Copper Bonding and is said to achieve a transistor density of 238 MTr/mm² as well as significantly better energy efficiency compared with its predecessor. The design distributes CPU, GPU, NPU and DSP across two stacked chiplets, shortens interconnects and thereby reduces power consumption and heat generation. Independent estimates and technical challenges remain; Huawei admits that design software and packaging still need further development, and describes aggressive 5-nm approaches without EUV as having failed. » Altro su golem.de

Taiwan Semiconductor Manufacturing Company reported stronger-than-expected demand for AI and high-performance computing chips and raised its revenue outlook. Shares have rallied, reflecting substantial outperformance over the past year, and the company remains a top contributor in Diamond Hill's Q2 2026 international fund holdings. TSMC holds roughly 70% foundry market share and continues to benefit from robust AI infrastructure spending and onshoring trends. » Altro su finance.yahoo.com

At SEMICON Taiwan officials and executives framed Taiwan, anchored by TSMC, as a reliable democratic supplier for the AI era while signaling willingness to share semiconductor benefits with like-minded partners. TSMC is investing $265 billion in Arizona and Taiwanese firms plan an additional $20 billion of U.S. investment, even as uncertainty remains over potential U.S. semiconductor tariffs tied to local production. Taiwan also seeks deeper ties with the EU under its Chips Act 2.0 as it balances diplomatic pressure from Beijing and strategic demands from the U.S. » Altro su finance.yahoo.com