ASML Holding

ASML and TSMC are collaborating to move High-NA EUV lithography from 6-inch to 12-inch masks, which ASML expects could raise scanner productivity by about 40% and remove stitching constraints. The larger-mask approach aims to improve economics for ASML's High-NA platform and help TSMC lower chip-making costs, but adoption faces high capital costs and staging delays. A pilot line is targeted for 2031 with production readiness by 2033, making the productivity gains a long-term, not immediate, earnings catalyst. » More on finance.yahoo.com

TSMC and Samsung plan to use ASML's new high-NA EUV technology to produce finer structures for AI chips and modern memory; Intel is also a customer. TSMC intends to use the machines in volume production from 2030, Samsung already from 2028 for DRAM production. Each tool costs around $400 million, and together with partners the companies are pushing the switch to larger 12-inch photomasks. The announcements increase clarity about future demand and support ASML's outlook. » More on deraktionaer.de

ASML will work with quantum-computing specialist Xanadu to investigate advanced lithography processes for photonic quantum hardware. The goal is to improve feature quality and reduce optical losses—such as line edge roughness—to enable scalable, error-resilient photonic quantum components. The cooperation covers research and process development; no short-term revenue effects are expected, but in the long term it could position ASML in a new growth market. » More on deraktionaer.de