Samsung GDR

Samsung announces the construction of two new chip factories as part of a joint project with SK Hynix and the state, which envisages total investments of up to around one trillion euros. The goal is to double Korean memory chip production within five years and to establish South Korea as an indispensable AI hub. The program includes extensive infrastructure and regional developments in Gwangju/South Jeolla as well as the parallel expansion of AI data centers. » More on faz.net

Samsung announces part of its planned large-scale investments for AI and semiconductor production, with the joint initiative with SK hynix totaling up to 2,000 trillion won over ten years (about 1.3 trillion USD). Investors reacted skeptically and Samsung shares fell sharply on the day of the presentation amid questions over financing, heavy capital commitment and uncertainty about the timetable and the actual locking-in of funds. Official details on the scale, timeline and the semiconductor-specific portion are expected in early July and should provide clarity for shareholders. » More on finanzen.net

Chip stocks fell sharply in Asia and Europe after profit-taking: Samsung and SK hynix slid markedly at times, while Infineon and equipment makers such as AIXTRON and Siltronic posted losses. The triggers were rising memory prices, concern about weakening demand for electronics after price increases, and growing risk aversion toward high AI valuations. Analysts still see the long-term potential for AI infrastructure, but investors are sensitive to signs of slower demand or lower margins. » More on finanzen.net

Political remarks from Seoul prompted profit-taking: Labor Minister Kim Young-hoon called for technology companies like Samsung to share the excess profits generated by the AI boom more with suppliers, subcontractors and employees. The announcement sparked nervousness in the markets and weighed heavily on Samsung's stock. Critics warn of competitive disadvantages, while supporters see it as a reinvestment to strengthen the industrial ecosystem. » More on finanzen.net

At Computex 2026 Samsung showcased HBM5 technology with a thermal management system called HPB that uses a chimney-like structure to reduce thermal resistance between dies and channel heat to a heat spreader without complicating IC design. For HBM5, Samsung plans a 2-nm base die and the use of GAA nodes from the foundry, as well as a 1c-nm frontend process and partial hybrid bonding on the core dies. Citi analysts expect this to provide significantly improved thermal stability and synergies between the memory and foundry businesses. » More on de.investing.com