ENSILICA PLC LS-,001

EnSilica has completed the production tape-out for an ASIC supply contract for an edge AI device; this triggers a one-time development and tape-out fee of $5 million, which will be recognized as revenue in fiscal years 2026 and 2027. The completion marks the end of the design and test phase and the start of production tooling and initial pilot runs. First silicon samples are expected in 2026, with volume production planned to start in 2027. Once mass production begins, the contract could generate up to $50 million in revenue over five years and become one of the company’s largest revenue-generating orders. » More on de.investing.com

The UK Space Agency is providing a further £30m for the C-LEO programme to support British firms developing satellite communications technologies. EnSilica said it will apply in the second funding round; it previously received £10.38m of non-dilutive funding for semiconductors for user terminals in low Earth orbit. According to EnSilica, the initial funding accelerated chipset development and led to customer contracts. The programme aims to secure UK firms market share in a global satellite communications market worth around £40bn, growing by more than 10% annually. » More on de.investing.com

EnSilica reported an EPS of -0.0052 for H1 2025 (expectation 0.022) and revenue of £12.7m (expectation £15.8m), with both metrics missing analyst expectations by a wide margin. The shares fell about 1.9% after the release. Year-on-year revenue rose 37% to a record H1, and EBITDA improved to £1.7m. Management remains optimistic, guiding full-year revenue of £28–30m and EBITDA of £3.5–4.5m, and points to c.95% contractually secured revenues as well as opportunities in the satellite and defence markets. » More on de.investing.com