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Notícias Ir para o feed de notícias
TSMC plans second US site near Dallas with six new fabs
TSMC intends to further expand its US presence and, according to reports, will build a second large fab campus in the Greater Dallas, Texas area with six new semiconductor plants. The planned campus is expected to be more expensive than the already ongoing Arizona project, for which ten fabs and two advanced backend fabs have so far been budgeted at $265 billion. Reasons include strong demand in the US, pressure from Washington, and space and energy constraints in Taiwan; Arizona also faces water and skilled labor supply issues. » Mais em golem.de
TSMC: labor disputes in Taiwan's chip sector could raise AI costs and supply security
Workers in Taiwan are demanding higher profit-sharing and long-term mechanisms, exemplified by the Micron spin-off, putting pressure on the chip industry's wage structure. TSMC responded proactively by expanding existing profit-sharing, while rising labor costs could weaken Taiwan's competitive advantage and thus the “Silicon Shield.” Higher chip prices would push up costs in the AI industry and across the IT value chain and influence resilience and production relocation decisions in the US and Europe. » Mais em wiwo.de
Taiwan Semiconductor holds dominant moat in AI data center chip market
Taiwan Semiconductor is the primary foundry for leading AI chipmakers and captured an estimated 72.5% of semiconductor revenue in the space, giving it a near-unalterable competitive advantage. Its vast production capacity, deep client ties and a $100 billion investment in Arizona capacity position it to benefit from rising data-center AI capital expenditures projected to grow into the trillions by 2030. That scale makes Taiwan Semiconductor the most direct beneficiary of continued AI build-out despite uncertainty over which companies win the GPU and AI compute wars. » Mais em finance.yahoo.com
Dividendos históricos Dividendos
Todos os indicadores de dividendos Todos os indicadoresDados financeiros da empresa
| (EUR) | junho de 2026 | |
|---|---|---|
| Receitas | 34,95 bi | 28,91% |
| Ganho bruto | 23,67 bi | 48,93% |
| Ganho líquido | 19,44 bi | 68,10% |
| EBITDA | 26,55 bi | 39,20% |
Dados fundamentais
| Métrica | Valor |
|---|---|
Capitalização bolsista | € 1,79 tri |
Número de ações | 25,93 bi |
Máximo/mínimo de 52 semanas | € 75,43 - € 36,25 |
Dividendos TTM | € 0,60 |
Próximo dividendo | € 0,19 |
Beta | 1,25 |
PER (PE Ratio) | 28,69 |
PEG (PEG Ratio) | 0,54 |
P/VC (PB Ratio) | 9,98 |
P/V (PS Ratio) | 14,45 |
Perfil da empresa
Taiwan Semiconductor Manufacturing Company Limited fertigt, verpackt, testet und verkauft integrierte Schaltungen und andere Halbleiterbauelemente in Taiwan, China, Europa, dem Nahen Osten, Afrika, Japan, den Vereinigten Staaten und international. Das Unternehmen bietet komplementäre Metalloxid-Silizium-Wafer-Fertigungsprozesse zur Herstellung von Logik-, Mixed-Signal-, Hochfrequenz- und Embedded-Memory-Halbleitern. Das Unternehmen bietet außerdem Kundenbetreuung, Kundenmanagement und technische Dienstleistungen an und stellt Masken her. Die Produkte des Unternehmens werden in den Bereichen mobile Geräte, Hochleistungscomputer, Automobilelektronik und Internet der Dinge eingesetzt. Das Unternehmen wurde 1987 gegründet und hat seinen Hauptsitz in Hsinchu City, Taiwan.
| Nome | TSMC |
| CEO | Che Chia Wei |
| Sede | Hsinchu City,
tpe Taiwan |
| Site | |
| Setor | Tecnologias da informação |
| Indústria | Semicondutores e equipamentos para semicondutores |
| Entrada em bolsa | 04/01/2000 |
| Colaboradores | 76.907 |
Análise aprofundada
Símbolos de ticker
| Bolsa | Símbolo |
|---|---|
Tai | 2330.TW |