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  • Broadcom CEO Hock Tan triggers global sell-off in chip stocks

    Comments by Broadcom CEO Hock Tan about exaggerated AI expectations and possible financing bottlenecks have sparked a worldwide sell-off in chip stocks; shares such as SK Hynix and Samsung fell sharply. Analysts warn that heavy investment by hyperscalers could lead to capital shortages and rising capital costs, weighing on the chip business. Increasing technological competition from China (CXMT) and very low P/E ratios at some manufacturers amplify doubts about the sustainability of profit margins. Market observers see heightened systemic risk from the strong concentration in the AI ecosystem, which could further worsen sentiment in the event of negative shocks. » Mais em handelsblatt.com


  • Broadcom CEO Hock Tan triggers global sell-off in chip stocks

    Comments by Broadcom CEO Hock Tan about overheated AI expectations and possible financing constraints have sparked a new wave of selling in semiconductor stocks. Affected names include SK Hynix, Samsung, Micron, ASML and European suppliers; investors fear capital shortages at the hyperscalers and rising costs of capital. Added pressures come from competitive risks from China (CXMT) and very low P/E ratios at some memory manufacturers, fueling doubts about the sustainability of profits. Analysts warn of a systemic risk from strong market concentration in the AI ecosystem, which could hit the market hard if quarterly results disappoint or if there are major disruptions. » Mais em handelsblatt.com


  • Broadcom seeks more than $50 billion financing for joint AI chip with OpenAI

    Broadcom is negotiating financing of over $50 billion to produce a custom AI chip developed together with OpenAI; potential lenders include Apollo and Blackstone, and a deal is being sought before year‑end. Oracle and SpaceX are also weighing large loans and bond issuances to buy Nvidia chips, as the build‑out of AI data centers strains normal financing sources. Experts warn that such debt financing can lead to persistent indebtedness, higher borrowing costs and increased risk of cash‑flow crises and rating downgrades. » Mais em n-tv.de

Em 2026, Broadcom já distribuiu € 1,70 em dividendos. A última distribuição ocorreu em setembro.

Dados financeiros da empresa

No último trimestre, Broadcom registou receitas de € 25,63 bi e um ganho líquido de € 11,34 bi
(EUR) agosto de 2026
YoY
Receitas 25,63 bi 86,19%
Ganho bruto 17,72 bi 91,83%
Ganho líquido 11,34 bi 217,30%
EBITDA 15,82 bi 128,37%

Dados fundamentais

Métrica Valor
Capitalização bolsista
€ 1,4 tri
Número de ações
4,77 bi
Máximo/mínimo de 52 semanas
€ 440,77 - € 258,19
Rentabilidade de dividendos
0,75%
Dividendos TTM
€ 2,26
Beta
1,48
PER (PE Ratio)
40,79
PEG (PEG Ratio)
0,41
P/VC (PB Ratio)
15,72
P/V (PS Ratio)
17,61

Perfil da empresa

Broadcom Inc. entwirft, entwickelt und liefert verschiedene Halbleiterbauelemente mit Schwerpunkt auf komplexen digitalen und Mixed-Signal-Bauelementen auf der Basis von komplementären Metalloxid-Halbleitern und analogen III-V-basierten Produkten weltweit. Das Unternehmen ist in zwei Segmenten tätig: Halbleiterlösungen und Infrastruktursoftware. Es bietet System-on-Chips (SoCs) für Set-Top-Boxen, SoCs für Kabel, digitale Teilnehmeranschlussleitungen und passive optische Netzwerke, SoCs für zentrale Büro-/Verbrauchergeräte, SoCs für drahtlose lokale Netzwerke, Ethernet-Switching- und Routing-Siliziumprodukte für Händler, eingebettete Prozessoren und Controller, anwendungsspezifische integrierte Schaltungen für Serialisierung/Deserialisierung, optische und kupferne sowie physikalische Schichten und Glasfaser-Sender- und -Empfängerkomponenten. Das Unternehmen bietet außerdem RF-Frontend-Module, Filter und Leistungsverstärker, Wi-Fi, Bluetooth und Global Positioning System/Global Navigation Satellite System SoCs, kundenspezifische Touch-Controller, Serial Attached Small Computer System Interface und Redundant Array of Independent Disks Controller und Adapter, Peripheral Component Interconnect Express Switches, Fibre Channel Host Bus Adapter, Read Channel basierte SoCs, kundenspezifische Flash-Controller, Vorverstärker und Optokoppler, industrielle Faseroptik und Motion Control Encoder und Subsysteme. Die Produkte des Unternehmens werden in verschiedenen Anwendungen eingesetzt, darunter Unternehmens- und Rechenzentrumsnetzwerke, Heimkonnektivität, Set-Top-Boxen, Breitbandzugang, Telekommunikationsgeräte, Smartphones und Basisstationen, Rechenzentrumsserver und Speichersysteme, Fabrikautomatisierung, Stromerzeugung und alternative Energiesysteme sowie elektronische Displays. Broadcom Inc. wurde im Jahr 2018 gegründet und hat seinen Hauptsitz in San Jose, Kalifornien.

Nome
Broadcom
CEO
Hock E. Tan
Sede Palo Alto, ca
EUA
Site
Setor
Tecnologias da informação
Indústria
Semicondutores e equipamentos para semicondutores
Entrada em bolsa
06/08/2009
Colaboradores 33.000

Símbolos de ticker

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XETRA
1YD.DE
Frankfurt
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München
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Berlin
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NASDAQ
AVGO
Düsseldorf
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Hamburg
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London
0YXG.L
SIX
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Wien
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Milan
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London Stock Exchange
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