TSMC

TSMC posted an August revenue record of 514.8 billion Taiwan dollars, its fourth consecutive month of rising sales. The figures reflect persistently stronger demand for AI chips alongside fully utilized 5-, 4- and 3-nanometer production lines. The shortage strengthens the market position of large foundries, increases pressure on competitors such as Samsung and Intel to expand their own capacities, and accelerates the need for new technologies like High NA EUV for production from 2030. » Mere på finanzen.net

Huawei introduces the Kirin 9050 Pro, which uses the Logic Folding technique to join two wafers via Hybrid Copper Bonding and is said to achieve a transistor density of 238 MTr/mm² as well as significantly better energy efficiency compared with its predecessor. The design distributes CPU, GPU, NPU and DSP across two stacked chiplets, shortens interconnects and thereby reduces power consumption and heat generation. Independent estimates and technical challenges remain; Huawei admits that design software and packaging still need further development, and describes aggressive 5-nm approaches without EUV as having failed. » Mere på golem.de

Taiwan Semiconductor Manufacturing Company reported stronger-than-expected demand for AI and high-performance computing chips and raised its revenue outlook. Shares have rallied, reflecting substantial outperformance over the past year, and the company remains a top contributor in Diamond Hill's Q2 2026 international fund holdings. TSMC holds roughly 70% foundry market share and continues to benefit from robust AI infrastructure spending and onshoring trends. » Mere på finance.yahoo.com