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Tokyo Ohka Kogyo posts record profits in 2025 and raises targets for 2026/2027

Tokyo Ohka Kogyo reported record results for fiscal 2025: revenue rose to ¥237.0 billion (+17.9%), operating profit to ¥47.4 billion (+43.2%) and profit attributable to owners to ¥33.3 billion (+47.0%), driven by strong demand for advanced semiconductor materials for AI chips. The company raised its medium-term targets through 2027, expects revenue of ¥261.0 billion for 2026 and plans significantly higher investments (capex 2026: ¥35.8 billion) as well as increased R&D spending. Tokyo Ohka Kogyo forecasts further growth particularly in packaging materials and EUV photoresists, raised the dividend and plans extensive capacity expansions to meet AI demand. » More on de.investing.com
Tokyo Ohka Kogyo: quarterly EPS $0.61 and revenue up 16.8%

Tokyo Ohka Kogyo reported earnings per share of $0.61 for the quarter ended 31 Dec. 2025 (prior year $0.38) on revenue of $417.0 million versus $357.1 million (+16.8%). For the full year, EPS was $1.86 (prior year $1.24) and annual revenue was $1.58 billion, an increase of 19.4% year on year. » More on finanzen.net

Historical dividends Dividends

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In 2026, TOKYO OHKA KOGYO has already paid €0.42 in dividends. The last payout was in September.

Financials

In the last quarter, TOKYO OHKA KOGYO had revenue of €391.07m and net profit of €46.78m

(EUR)	June 2026	YoY
Revenue	391.07m	15.58%
Gross profit	144.84m	18.77%
Net profit	46.78m	30.17%
EBITDA	89.4m	19.89%

Fundamentals

Metric	Value
Market capitalization	€5.07bn
Number of shares	119.98m
52-week high/low	€73.55 - €28.20
Dividend yield	0.78%
Dividends TTM	€0.43
Beta	0.91
P/E ratio	22.18
PEG ratio	0.46
P/B ratio	3.59
P/S ratio	3.36

Company profile

Tokyo Ohka Kogyo Co., Ltd., together with its subsidiaries, manufactures and sells chemical products and process equipment in Japan and internationally. The company offers optimal photoresists and photolithography relative chemicals; and coating, developing, vacuum UV hardening, and chemical supply machines. It also provides adhesive materials, thinners for the removing of adhesive materials, structure materials, surface modification materials, micro processing films, thin film mmWave absorbers, polyimide films, and zero Newton bonding and debonding machines for 3D semiconductor packaging. The company's products are used in the production of semiconductor devices, mobile devices, tablets, personal computers, wearable devices, servers, supercomputers, game consoles, MEMS and image sensors, IoT, AI autonomous vehicles, ADAS, robotics, renewable energy equipment, eco-cars, panel manufacturing, televisions, and various displays. In addition, it offers insurance agency services. The company was incorporated in 1940 and is headquartered in Kawasaki, Japan.