ASM PAC.TECHN.ADR 3/HD-1

ASM Pacific Technology Limited, an investment holding company, engages in the design, manufacture, and marketing of machines, tools, and materials used in the semiconductor and electronics assembly industries worldwide. It operates through Semiconductor Solutions and Surface Mount Technology Solutions segments. The company provides deposition process equipment, wafer separation equipment, AOI/FOL equipment, die attach equipment, wire bonding equipment, dispensing equipment, encapsulation solutions equipment, and CIS equipment. It also offers singulation, trim, and form systems; LED testing, sorting, and taping systems; sintering equipment; and test and finish handling systems. In addition, the company offers surface mount technologies; advanced packaging solutions; encapsulation solutions; MEM solutions; power solutions; LED/opto solutions; photonics solutions; COB solutions; stacked die solutions; and smart SMT factory solutions, as well as image sensor applications. Further, it provides agency and logistics services. The company was founded in 1975 and is based in Tsing Yi, Hong Kong.