TSMC

Taiwan Semiconductor Manufacturing reported record August revenue of over $16 billion, up 53% year‑over‑year and 10% month‑over‑month, with January–August revenue nearly 40% higher year‑over‑year. TSMC attributed the gains to strong demand for AI chips, reinforcing visibility across the AI supply chain. The report adds confirmation to Nvidia's recent demand trends for data‑center GPUs and supports a positive near‑term outlook for Nvidia's AI-driven revenue growth. » More on finance.yahoo.com

TSMC posted an August revenue record of 514.8 billion Taiwan dollars, its fourth consecutive month of rising sales. The figures reflect persistently stronger demand for AI chips alongside fully utilized 5-, 4- and 3-nanometer production lines. The shortage strengthens the market position of large foundries, increases pressure on competitors such as Samsung and Intel to expand their own capacities, and accelerates the need for new technologies like High NA EUV for production from 2030. » More on finanzen.net

Huawei introduces the Kirin 9050 Pro, which uses the Logic Folding technique to join two wafers via Hybrid Copper Bonding and is said to achieve a transistor density of 238 MTr/mm² as well as significantly better energy efficiency compared with its predecessor. The design distributes CPU, GPU, NPU and DSP across two stacked chiplets, shortens interconnects and thereby reduces power consumption and heat generation. Independent estimates and technical challenges remain; Huawei admits that design software and packaging still need further development, and describes aggressive 5-nm approaches without EUV as having failed. » More on golem.de