Intel

Intel reports progress on process nodes (Intel 18A, 14A) and sees demand in the data center/AI segment as the main growth driver. After a capital raise of $23 billion, the company increased planned capital expenditures for 2026 from $18 billion to $20 billion and plans further spending through 2028 to build capacity. The foundry business currently posts operating losses of about $2.5 billion per quarter; breakeven is targeted for end-2027 (may slip into 2028). Advanced Packaging (particularly EMIB-T) is viewed as a high-margin long-term opportunity, and CEO Lip-Bu Goh has streamlined the organization to speed decision-making. » More on de.investing.com

Advanced Micro Devices launched a four-part bond offering to raise $4–5 billion for general corporate purposes and to support its data-center AI push, issuing notes due 2029–2036. Intel completed an upsized $20 billion stock offering priced at $95 per share to fund capital expenditures for custom AI silicon and advanced packaging, diluting existing shareholders. AMD’s debt preserves equity but increases leverage risk, while Intel’s equity raise avoids new debt but signals further shareholder dilution and higher future spending. » More on finance.yahoo.com

Intel said enterprise AI is moving from pilots into production and companies are increasingly focusing on return on investment, cost control and data sovereignty rather than just speed. Anil Nanduri stressed that “not all tokens are equal” and that hybrid models—on‑premises open‑weight models plus frontier models as needed—are likely to dominate. Intel recommends a heterogeneous infrastructure of CPUs, GPUs and specialized accelerators, highlights network and storage bottlenecks, and announced product and partner initiatives such as Crescent Island GPUs and collaboration with SambaNova. » More on de.investing.com