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BESI.AS

BE Semiconductor Ind.

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  • BE Semiconductor after 40% decline: Berenberg sees buying opportunity

    BE Semiconductor has experienced a marked correction after a drop of just over 40% from its high. Analysts at Berenberg rate the stock as a buy and see an entry opportunity for a counter-move. Besi supplies high-precision assembly and advanced-packaging systems, which are regarded as a central growth driver in the AI chip market. » Altro su finanzen.net


  • BE Semiconductor falls after delay in hybrid-bonding technology

    BE Semiconductor's shares fell further, dropping about 3.8% to €248.4 after reports suggested Samsung and SK Hynix could delay the use of hybrid-bonding technology for HBM. The reason appears to be new heat-dissipation solutions that reduce the urgent need to switch from thermocompression bonding and may make hybrid-bonding relevant only for later HBM generations. The potential delay hits BESI particularly hard, as hybrid-bonding is seen as a key growth driver and a major Samsung decision had been expected by mid-2026. Investors face increased uncertainty until the next report on July 23, while the sector as a whole is reacting to a slower pace of advanced-packaging investment. » Altro su de.investing.com


  • BE Semiconductor falls sharply after reports of delay in hybrid bonding

    BE Semiconductor’s shares fell about 7.5% to €252.60 after reports that Samsung and SK Hynix could delay the rollout of the hybrid-bonding process. The reason cited is a new heat-dissipation technology that could reduce the need for advanced packaging processes for HBM memory. The potential delay hits BE Semiconductor’s core revenue driver and compounds already negative analyst sentiment; Zacks recently cut its rating to "Hold." The next quarterly report on 23 July 2026 is likely to offer only limited visibility, while the stock is trading roughly 23% below its mid-June 52-week high. » Altro su de.investing.com


  • BE Semiconductor raises revenue and margin targets and shares climb

    BE Semiconductor shares rose 1.1% to €313.50 after the company at its Investor Day raised its revenue forecast to €1.7–2.2 billion (previously €1.5–1.9 billion) and increased the lower end of the operating margin from 40% to 45% (upper end 55%). Management cited robust demand from AI data centers and optical photonics and accelerated adoption of hybrid bonding as reasons, but did not provide a timeframe for the targets. Analyst reactions were positive: JPMorgan raised its price target and Goldman Sachs reiterated its buy recommendation, which, together with a constructive industry backdrop, supported the price movement. » Altro su de.investing.com


  • BE Semiconductor rises after results, Deutsche Bank raises price target to €215

    Shares of BE Semiconductor climbed about 5 percent and approached their record high after positive reactions to the company’s results. Deutsche Bank raised its price target to €215, citing sustained strong demand and possible integration of Dutch technology into Samsung’s HBM4E chips, a decision likely by June. At the same time, Bank of America rates Europe’s chip sector as underweight after the strong rally and recommends defensive sectors. » Altro su finanzen.net

Nel 2026, BE Semiconductor Ind. ha già distribuito 1,58 € di dividendi. L'ultimo pagamento è avvenuto a maggio.

Dati finanziari dell'azienda

Nell'ultimo trimestre, BE Semiconductor Ind. ha registrato ricavi pari a 283,4 Mln € e un utile netto di 107,19 Mln €
(EUR) settembre 2026
YoY
Ricavi 283,4 Mln 113,51%
Utile lordo 178,67 Mln 131,98%
Utile netto 107,19 Mln 324,02%
EBITDA 139,88 Mln 216,87%

Dati fondamentali

Metrica Valore
Capitalizzazione di mercato
11,34 Mld €
Numero di azioni
79,08 Mln
Massimo/minimo a 52 settimane
328,40 € - 120,15 €
Rendimento da dividendo
1,06%
Dividendi TTM
1,58 €
Beta
1,36
Rapporto P/E
39,50
Rapporto PEG
0,42
Rapporto P/B
17,50
Rapporto P/S
12,82

Profilo aziendale

BE Semiconductor Industries N.V. sviluppa, produce, commercializza, vende e fornisce servizi di assistenza per apparecchiature di assemblaggio di semiconduttori destinate ai settori dei semiconduttori e dell'elettronica in tutto il mondo. I principali prodotti dell'azienda includono apparecchiature per il die attach, come quelle per single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid e embedded bridge die bonding, e sistemi di selezione dei die; e apparecchiature per il packaging, tra cui stampaggio convenzionale, ultra thin e wafer level, nonché sistemi di trim and form e di singolazione. I suoi prodotti principali comprendono anche apparecchiature per la placcatura, che includono placcatura con stagno, rame e metalli preziosi, e sistemi di placcatura solare, oltre ai relativi prodotti chimici di processo; nonché utensili, kit di conversione, ricambi e altri servizi. I principali marchi dell'azienda includono Datacon, Esec, Fico e Meco. L'azienda offre i propri prodotti principalmente a produttori multinazionali di chip, subappaltatori di assemblaggio e aziende dell'elettronica e industriali. La società è stata costituita nel 1995 e ha sede a Duiven, nei Paesi Bassi.

Nome
BE Semiconductor Ind.
CEO
Richard W. Blickman
Sede centrale Duiven, ge
Paesi Bassi
Sito web
Settore
Tecnologia dell'informazione
Industria
Semiconduttori e apparecchiature per semiconduttori
Quotazione in borsa
20/07/1998
Dipendenti 2001

Simboli di borsa

Borsa Simbolo
Euronext
BESI.AS
Pnk
BESVF
Amsterdam
BESI.AS
XETRA
BSI.DE
Düsseldorf
BSI.DU
London
0XVE.L
München
BSI.MU
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