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BE Semiconductor after 40% decline: Berenberg sees buying opportunity
BE Semiconductor has experienced a marked correction after a drop of just over 40% from its high. Analysts at Berenberg rate the stock as a buy and see an entry opportunity for a counter-move. Besi supplies high-precision assembly and advanced-packaging systems, which are regarded as a central growth driver in the AI chip market. » Altro su finanzen.net
BE Semiconductor falls after delay in hybrid-bonding technology
BE Semiconductor's shares fell further, dropping about 3.8% to €248.4 after reports suggested Samsung and SK Hynix could delay the use of hybrid-bonding technology for HBM. The reason appears to be new heat-dissipation solutions that reduce the urgent need to switch from thermocompression bonding and may make hybrid-bonding relevant only for later HBM generations. The potential delay hits BESI particularly hard, as hybrid-bonding is seen as a key growth driver and a major Samsung decision had been expected by mid-2026. Investors face increased uncertainty until the next report on July 23, while the sector as a whole is reacting to a slower pace of advanced-packaging investment. » Altro su de.investing.com
BE Semiconductor falls sharply after reports of delay in hybrid bonding
BE Semiconductor’s shares fell about 7.5% to €252.60 after reports that Samsung and SK Hynix could delay the rollout of the hybrid-bonding process. The reason cited is a new heat-dissipation technology that could reduce the need for advanced packaging processes for HBM memory. The potential delay hits BE Semiconductor’s core revenue driver and compounds already negative analyst sentiment; Zacks recently cut its rating to "Hold." The next quarterly report on 23 July 2026 is likely to offer only limited visibility, while the stock is trading roughly 23% below its mid-June 52-week high. » Altro su de.investing.com
BE Semiconductor raises revenue and margin targets and shares climb
BE Semiconductor shares rose 1.1% to €313.50 after the company at its Investor Day raised its revenue forecast to €1.7–2.2 billion (previously €1.5–1.9 billion) and increased the lower end of the operating margin from 40% to 45% (upper end 55%). Management cited robust demand from AI data centers and optical photonics and accelerated adoption of hybrid bonding as reasons, but did not provide a timeframe for the targets. Analyst reactions were positive: JPMorgan raised its price target and Goldman Sachs reiterated its buy recommendation, which, together with a constructive industry backdrop, supported the price movement. » Altro su de.investing.com
BE Semiconductor rises after results, Deutsche Bank raises price target to €215
Shares of BE Semiconductor climbed about 5 percent and approached their record high after positive reactions to the company’s results. Deutsche Bank raised its price target to €215, citing sustained strong demand and possible integration of Dutch technology into Samsung’s HBM4E chips, a decision likely by June. At the same time, Bank of America rates Europe’s chip sector as underweight after the strong rally and recommends defensive sectors. » Altro su finanzen.net
Dividendi storici Dividendi
Tutte le metriche sui dividendi Tutte le metricheDati finanziari dell'azienda
| (EUR) | settembre 2026 | YoY |
|---|---|---|
| Ricavi | 283,4 Mln | 113,51% |
| Utile lordo | 178,67 Mln | 131,98% |
| Utile netto | 107,19 Mln | 324,02% |
| EBITDA | 139,88 Mln | 216,87% |
Dati fondamentali
| Metrica | Valore |
|---|---|
Capitalizzazione di mercato | 11,34 Mld € |
Numero di azioni | 79,08 Mln |
Massimo/minimo a 52 settimane | 328,40 € - 120,15 € |
Rendimento da dividendo | 1,06% |
Dividendi TTM | 1,58 € |
Beta | 1,36 |
Rapporto P/E | 39,50 |
Rapporto PEG | 0,42 |
Rapporto P/B | 17,50 |
Rapporto P/S | 12,82 |
Profilo aziendale
BE Semiconductor Industries N.V. sviluppa, produce, commercializza, vende e fornisce servizi di assistenza per apparecchiature di assemblaggio di semiconduttori destinate ai settori dei semiconduttori e dell'elettronica in tutto il mondo. I principali prodotti dell'azienda includono apparecchiature per il die attach, come quelle per single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid e embedded bridge die bonding, e sistemi di selezione dei die; e apparecchiature per il packaging, tra cui stampaggio convenzionale, ultra thin e wafer level, nonché sistemi di trim and form e di singolazione. I suoi prodotti principali comprendono anche apparecchiature per la placcatura, che includono placcatura con stagno, rame e metalli preziosi, e sistemi di placcatura solare, oltre ai relativi prodotti chimici di processo; nonché utensili, kit di conversione, ricambi e altri servizi. I principali marchi dell'azienda includono Datacon, Esec, Fico e Meco. L'azienda offre i propri prodotti principalmente a produttori multinazionali di chip, subappaltatori di assemblaggio e aziende dell'elettronica e industriali. La società è stata costituita nel 1995 e ha sede a Duiven, nei Paesi Bassi.
| Nome | BE Semiconductor Ind. |
| CEO | Richard W. Blickman |
| Sede centrale | Duiven,
ge Paesi Bassi |
| Sito web | |
| Settore | Tecnologia dell'informazione |
| Industria | Semiconduttori e apparecchiature per semiconduttori |
| Quotazione in borsa | 20/07/1998 |
| Dipendenti | 2001 |
Simboli di borsa
| Borsa | Simbolo |
|---|---|
Euronext | BESI.AS |
Pnk | BESVF |
Amsterdam | BESI.AS |
XETRA | BSI.DE |
Düsseldorf | BSI.DU |
London | 0XVE.L |
München | BSI.MU |